Job Description
Engineering
NXP USA, Inc. has multiple openings at various professional levels in Chandler, AZ. EQUIPMENT ENGINEER to develop and implement operational and maintenance procedures in furtherance of semiconductor wafer manufacturing excellence and delivery of high quality, scalable, and cost competitive semiconductor devices. ANALOG CIRCUIT ENGINEER to perform semiconductor design engineering duties in furtherance of research and development of in-house software products and devices and related products for the electronic communications industry. PROCESS ENGINEER to perform semiconductor engineering duties for firm devices in conjunction with hardware product development for the electronic communications industry. PRINCIPAL IC PACKAGING ENGINEER to perform engineering duties in furtherance of development of new IC packaging solutions and new packaging technology for all NXP products. To apply, send resume and cover letter to NXP USA, Inc. via email at chris.humphrey@nxp.com and reference job title of position and job location.